izakhiwo zomkhiqizo
UHLOBO ICHAZA
isigaba se-Integrated Circuit (IC)
Imemori - Ukucushwa kwe-PROM ye-FPGA
umenzi we-AMD Xilinx
uchungechunge -
Ukufakwa kwepayipi lephakeji
Isimo somkhiqizo sinqanyuliwe
Uhlobo oluhlelekayo Oluhlelekayo ohlelweni
isitoreji 4Mb
I-Voltage – Inamandla angu-3V ~ 3.6V
Izinga lokushisa lokusebenza -40°C ~ 85°C
uhlobo lokufakwa kwe-Surface Mount Type
Iphakheji/I-Enclosure 20-TSSOP (0.173″, 4.40mm ububanzi)
Ukupakishwa Kwedivayisi Yomhlinzeki 20-TSSOP
Inombolo yomkhiqizo eyisisekelo XCF04
bika iphutha
Usesho olusha lweParametric
Imidiya nokulandiwe
ISIXHUMANISI SOHLOBO LWESIZATHU
Imininingwane ye-XCFxx(S,P) I-Flash PROMS ye-Platform
Ulwazi lwezemvelo i-Xilinx REACH211 Cert
Isitifiketi se-Xiliinx RoHS
Ukushintsha Komkhiqizo we-PCN/Ukuyekwa kwe-Mult Dev EOL 17/May/2021
Ukuphela Kwempilo 10/JAN/2022
I-PCN Assembly/Source Location Chg 22/Feb/2016
Ukuhlelwa Kwemvelo kanye Nokuthekelisa
IZIMPAWU ZIYACHAZA
Isimo se-RoHS Sihambisana nokucaciswa kwe-ROHS3
Izinga Lokuzwela Komswakama (MSL) 3 (amahora angu-168)
Finyelela isimo Imikhiqizo engafinyeleli
I-ECCN 3A991B1B1
I-HTSUS 8542.32.0071
