Izakhiwo Zomkhiqizo
UHLOBO | CHAZA |
isigaba | I-Integrated Circuit (IC) Kushumekiwe - Ama-Microcontrollers |
umkhiqizi | Inkampani NXP USA INC. |
uchungechunge | I-MPC56xx Qorivva |
Iphakheji | ugqoko |
isimo somkhiqizo | kukhona kusitoki |
core processor | e200z4d, e200z0h |
Ukucaciswa kwe-kernel | I-32-bit dual core |
isivinini | 80MHz/120MHz |
Ukuxhumana | I-CANbus, i-Ethernet, i-I²C, i-LINbus, i-SCI, i-SPI |
Amapheripheral | I-DMA, POR, PWM, WDT |
I/O ukubala | 147 |
Umthamo wesitoreji sohlelo | 2MB (2M x 8) |
Uhlobo lwenkumbulo yohlelo | flash |
Umthamo we-EEPROM | 64k x8 |
Usayizi we-RAM | 256K x 8 |
I-Voltage – Power Supply (Vcc/Vdd) | 3V ~ 5.5V |
isiguquli sedatha | A/D 27x10b, 5x12b |
Uhlobo lwe-Oscillator | yangaphakathi |
Izinga lokushisa lokusebenza | -40°C ~ 105°C (TA) |
uhlobo lokufaka | Uhlobo Lwentaba Engaphezulu |
Iphakheji/Indawo Evalekile | 176-LQFP |
Ukupakishwa Kwedivayisi Yomhlinzeki | 176-LQFP (24×24) |
Inombolo yomkhiqizo eyisisekelo | I-SPC5645 |
Amadokhumenti Nemidiya
UHLOBO LOKUSEBENZA | LINK |
Ulwazi lwezemvelo | I-NXP USA Inc REACH211 Cert I-NXP USA Inc RoHS3 Cert |
Imikhiqizo efakiwe | Umshini Wokudayisa Amathikithi |
I-PCN Design/Specification | I-Mult Dev DS Chg 11/Feb/2022 |
Iphakheji ye-PCN | Konke Ukubuyekezwa Kwelebula ye-Dev 15/Dec/2020 I-Mult Dev Pkg Seal 15/Dec/2020 |
Ukuhlelwa Kwemvelo kanye Nokuthekelisa
IZIMPAWU | CHAZA |
Isimo se-RoHS | Ihambisana nokucaciswa kwe-ROHS3 |
Izinga Lokuzwela Komswakama (MSL) | 3 (amahora angu-168) |
REACH isimo | Imikhiqizo engafinyeleli |
ECCN | 5A992C |
HTSUS | 8542.31.0001 |