Izakhiwo Zomkhiqizo
| UHLOBO | CHAZA |
| isigaba | I-Integrated Circuit (IC) Ishumekiwe - Ama-Microcontrollers |
| umkhiqizi | Inkampani NXP USA INC. |
| uchungechunge | I-MPC56xx Qorivva |
| Iphakheji | ugqoko |
| isimo somkhiqizo | kukhona kusitoki |
| core processor | e200z0h |
| Ukucaciswa kwe-kernel | 32-bit umongo owodwa |
| isivinini | 64MHz |
| Ukuxhumana | CANbus,I²C,LIN,SCI,SPI |
| Amapheripheral | DMA , POR , PWM , WDT |
| Inombolo ye-I/O | 79 |
| Umthamo wesitoreji sohlelo | 512KB (512K x 8) |
| Uhlobo lwenkumbulo yohlelo | flash |
| Umthamo we-EEPROM | 64k x8 |
| Usayizi we-RAM | 32k x 8 |
| I-Voltage – Power Supply (Vcc/Vdd) | 3V ~ 5.5V |
| isiguquli sedatha | I-A/D 28x10b |
| Uhlobo lwe-Oscillator | yangaphakathi |
| Izinga lokushisa lokusebenza | -40°C ~ 85°C (TA) |
| uhlobo lokufaka | Uhlobo Lwentaba Engaphezulu |
| Iphakheji/Indawo Evalekile | 100-LQFP |
| Ukupakishwa Kwedivayisi Yomhlinzeki | 100-LQFP (14×14) |
| Inombolo yomkhiqizo eyisisekelo | I-SPC5604 |
Amadokhumenti kanye Nemidiya
| UHLOBO LOKUSEBENZA | LINK |
| Imininingwane | I-MPC5604B/C |
| Ulwazi lwezemvelo | I-NXP USA Inc RoHS3 Cert I-NXP USA Inc REACH211 Cert |
| Imikhiqizo efakiwe | Umshini Wokudayisa Amathikithi |
| I-PCN Design/Specification | I-Mult Dev DS Chg 11/Feb/2022 Isibuyekezo se-Datasheet 24 / Mar / 2015 |
| Iphakheji ye-PCN | Konke Ukubuyekezwa Kwelebula ye-Dev 15/Dec/2020 I-Mult Dev Pkg Seal 15/Dec/2020 |
| Imininingwane ye-HTML | I-MPC5604B/C |
Ukuhlelwa Kwemvelo kanye Nokuthekelisa
| IZIMPAWU | CHAZA |
| Isimo se-RoHS | Ihambisana nokucaciswa kwe-ROHS3 |
| Izinga Lokuzwela Komswakama (MSL) | 3 (amahora angu-168) |
| REACH isimo | Imikhiqizo engafinyeleli |
| BALEKA | 3A991A2 |
| HTSUS | 8542.31.0001 |
