I-Intel itshala amanye amadola ayizigidi eziyizinkulungwane ezingama-20 ukwakha izimboni ezimbili zama-chip.Inkosi yobuchwepheshe be-"1.8nm" iyabuya

NgoSepthemba 9, ngesikhathi sendawo, isikhulu se-Intel uKissinger wamemezela ukuthi uzotshala amaRandi ayizigidi eziyizinkulungwane ezingama-20 ukuze kwakhiwe ifektri entsha enkulukazi e-Ohio, e-United States.Lokhu kuyingxenye yesu le-Intel IDM 2.0.Lonke uhlelo lokutshala izimali lufinyelela ku-$100 billion.Imboni entsha kulindeleke ukuthi ikhiqizwe ngobuningi ngo-2025. Ngaleso sikhathi, inqubo ye-“1.8nm” izobuyisela i-Intel esikhundleni somholi we-semiconductor.

Selokhu aba yi-Intel CEO ngoFebhuwari wonyaka odlule, uKissinger ukhuthaze ngamandla ukwakhiwa kwamafekthri e-United States nasemhlabeni jikelele, lapho okungenani u-US $ 40 billion etshalwe e-United States.Ngonyaka odlule, utshale ama-US $ 20 wezigidigidi e-Arizona ukuze akhe imboni yama-wafer.Kulokhu, uphinde watshala ama-US $ 20 billion e-Ohio, futhi wakha nefekthri entsha yokuvala nokuhlola eNew Mexico.

I-Intel itshala amanye amadola ayizigidi eziyizinkulungwane ezingama-20 ukwakha izimboni ezimbili zama-chip.Inkosi yobuchwepheshe be-"1.8nm" iyabuya

Imboni ye-Intel futhi iyifekthri enkulu ye-semiconductor chip esanda kwakhiwa e-United States ngemuva kokuphasiswa kwebhilidi ye-chip subsidy yama-dollar ayizigidi eziyizinkulungwane ezingama-52.8.Ngenxa yalesi sizathu, umongameli wase-United States naye waya emcimbini wokuqalisa, kanye nombusi wase-Ohio nezinye izikhulu eziphezulu zeminyango yendawo.

I-Intel itshala amanye amadola ayizigidi eziyizinkulungwane ezingama-20 ukwakha izimboni ezimbili zama-chip.Inkosi yobuchwepheshe be-"1.8nm" iyabuya

Isisekelo sokukhiqiza ama-chip e-Intel sizokwakhiwa amafekthri amabili ama-wafer, angahlalisa amafekthri afinyelela kwayisishiyagalombili kanye nezinhlelo ezisekela imvelo.Ihlanganisa indawo ecishe ibe ngamahektha ayi-1000, okungukuthi, amakhilomitha-skwele ama-4.Izovula imisebenzi ekhokha kakhulu eyizi-3000, imisebenzi yezokwakha eyizi-7000, kanye namashumi ezinkulungwane zemisebenzi yokubambisana kwezemisebenzi.

Lezi zimboni ezimbili zama-wafer kulindeleke ukuthi zikhiqize ngobuningi ngo-2025. I-Intel ayizange isho ngokuqondile izinga lenqubo yefekthri, kodwa i-Intel yathi ngaphambilini izoba yingcweti yenqubo ye-CPU yesizukulwane esi-5 phakathi neminyaka emi-4, futhi izokhiqiza ngobuningi i-20a. kanye 18a nezinqubo zezizukulwane ezimbili ngo-2024. Ngakho-ke, ifektri lapha kufanele futhi ikhiqize inqubo ye-18a ngaleso sikhathi.

I-20a kanye ne-18a yizinqubo zokuqala ze-chip emhlabeni ukufinyelela izinga le-EMI, elilingana nezinqubo zabangane ezingu-2nm kanye ne-1.8nm.Bazophinde bethule ubuchwepheshe obubili be-Intel black technology, i-ribbon FET ne-powervia.

Ngokusho kwe-Intel, i-ribbonfet ukuqaliswa kwe-Intel kwesango nxazonke ze-transistors.Izoba i-architecture yokuqala entsha sha selokhu inkampani yethula i-FinFET okokuqala ngo-2011. Lobu buchwepheshe busheshisa isivinini sokushintshwa kwe-transistor futhi bufinyelela izinga lokushayela elifanayo nesakhiwo se-multi fin, kodwa kuthatha isikhala esincane.

I-Powervia iyingqayizivele ye-Intel futhi iyinethiwekhi yokuqala yokudlulisela amandla emuva embonini, eyenza kahle ukudluliswa kwesignali ngokususa isidingo sokuhlinzekwa kwamandla kanye