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[I-Core Vision] Izinga lesistimu ye-OEM: I-Intel's turning chips

Imakethe ye-OEM, esemanzini ajulile, iye yahlushwa ikakhulukazi muva nje.Ngemuva kokuthi abakwaSamsung bethe bazokhiqiza i-1.4nm ngo-2027 futhi i-TSMC ingase ibuyele esihlalweni se-semiconductor, i-Intel iphinde yethula “i-OEM yesistimu” ukusiza kakhulu i-IDM2.0.

 

Engqungqutheleni ye-Intel On Technology Innovation ebanjwe muva nje, i-CEO uPat Kissinger umemezele ukuthi i-Intel OEM Service (IFS) izongenisa inkathi “yezinga lesistimu ye-OEM”.Ngokungafani nemodi yendabuko ye-OEM enikeza kuphela amakhasimende amandla okukhiqiza ama-wafer, i-Intel izohlinzeka ngesixazululo esibanzi esimboza ama-wafers, amaphakheji, isofthiwe nama-chips.U-Kissinger ugcizelele ukuthi "lokhu kuphawula ukushintsha kwepharadigm kusuka ohlelweni ku-chip kuya ohlelweni kuphakheji."

 

Ngemuva kokuthi i-Intel isheshise imashi yayo ibheke ku-IDM2.0, yenze izinto eziqhubekayo muva nje: noma ngabe ivula i-x86, ijoyina ikamu le-RISC-V, ithola umbhoshongo, yandisa umfelandawonye we-UCIe, imemezela amashumi ezigidigidi zamadola wohlelo lokukhulisa umugqa wokukhiqiza we-OEM, njll. ., okubonisa ukuthi izoba nethemba elimangalisayo emakethe ye-OEM.

 

Manje, ingabe i-Intel, enikeze "umnyakazo omkhulu" wokwenziwa kwenkontileka yezinga lesistimu, izongeza ama-chips amaningi empini "Yababusi Abathathu"?

 

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"Ukuphuma" komqondo we-OEM wezinga lesistimu usuvele ulandelelwe.

 

Ngemva kokuncipha koMthetho kaMoore, ukuzuza ibhalansi phakathi kokuminyana kwe-transistor, ukusetshenziswa kwamandla nosayizi kubhekene nezinselele eziningi.Kodwa-ke, izinhlelo zokusebenza ezivelayo ziya ngokuya zifuna ukusebenza okuphezulu, amandla ekhompiyutha anamandla kanye nama-chips ahlanganisiwe ahlukahlukene, okwenza imboni ihlole izixazululo ezintsha.

 

Ngosizo lokuklama, ukukhiqiza, ukupakisha okuthuthukisiwe kanye nokukhuphuka kwakamuva kwe-Chiplet, kubonakala sengathi sekuyisivumelwano sokubona “ukusinda” koMthetho kaMoore kanye noshintsho oluqhubekayo lokusebenza kwe-chip.Ikakhulukazi esimweni sokuncishiswa kwenqubo elinganiselwe esikhathini esizayo, inhlanganisela ye-chiplet nokupakishwa okuthuthukisiwe kuzoba yisixazululo esinqamula uMthetho kaMoore.

 

Ifekthri ebambele, “okungamandla amakhulu” edizayini yokuxhuma, ukukhiqiza nokupakisha okuthuthukile, kusobala ukuthi inezinzuzo nezinsiza ezingavuselelwa.Ngokuqaphela lo mkhuba, abadlali abaphezulu, njenge-TSMC, Samsung ne-Intel, bagxile ekwakhiweni.

 

Ngokombono womuntu osesikhundleni esiphezulu embonini ye-semiconductor ye-OEM, i-OEM yezinga lesistimu iwumkhuba ongenakugwema esikhathini esizayo, okulingana nokunwetshwa kwemodi ye-pan IDM, efana ne-CIDM, kodwa umehluko ukuthi i-CIDM iwumsebenzi ovamile izinkampani ezahlukene ukuze zixhumeke, kuyilapho i-pan IDM iwukuhlanganisa imisebenzi eyahlukene ukuze inikeze amakhasimende i-TurnkeySolution.

 

Engxoxweni nabakwaMicronet, u-Intel uthe ezinhlelweni ezine zokusekela ze-OEM yesistimu, i-Intel inokuqoqwa kobuchwepheshe obunenzuzo.

 

Ezingeni lokukhiqiza i-wafer, i-Intel ithuthukise ubuchwepheshe obusha obufana ne-RibbonFET transistor architecture kanye nogesi we-PowerVia, futhi isebenzisa kancane kancane uhlelo lokukhuthaza ama-process node amahlanu phakathi neminyaka emine.I-Intel inganikeza nobuchwepheshe bokupakisha obuthuthukile obufana ne-EMIB ne-Foveros ukusiza amabhizinisi okuklama ama-chip ahlanganise izinjini ezahlukene zekhompiyutha kanye nobuchwepheshe bokucubungula.Izingxenye eziyinhloko ze-modular zinikeza ukuguquguquka okukhulu kokuklama futhi ziqhubekisela yonke imboni ukuthi isungule izinto ezintsha ngentengo, ukusebenza kanye nokusetshenziswa kwamandla.I-Intel izibophezele ekwakheni umfelandawonye we-UCIe ukusiza ama-cores avela kubahlinzeki abahlukene noma izinqubo ezahlukene zisebenze ndawonye kangcono.Mayelana nesofthiwe, amathuluzi esofthiwe yomthombo ovulekile we-Intel i-OpenVINO kanye ne-oneAPI ingasheshisa ukulethwa komkhiqizo futhi inike amandla amakhasimende ukuhlola izixazululo ngaphambi kokukhiqiza.

 
“Ngabavikeli” abane bezinga lesistimu ye-OEM, i-Intel ilindele ukuthi ama-transistors ahlanganiswe ku-chip eyodwa azokhula ngokuphawulekayo ukusuka ku-100 billion wamanje ukuya ezingeni lethriliyoni, okuyisiphetho esibikezelwe ngaphambili.

 

"Kungabonakala ukuthi inhloso ye-OEM yesistimu ye-Intel ihambisana nesu le-IDM2.0, futhi inamandla amakhulu, azobeka isisekelo sentuthuko ye-Intel yesikhathi esizayo."Abantu abangenhla baphinde bazwakalisa ithemba labo nge-Intel.

 

I-Lenovo, edume “ngesixazululo se-chip eyodwa”, kanye nezinga le-OEM entsha yesistimu “yokukhiqiza okukodwa”, ingase ilethe izinguquko ezintsha emakethe ye-OEM.

 

Ama-chips awinile

 

Eqinisweni, i-Intel yenze amalungiselelo amaningi ezinga lesistimu ye-OEM.Ngokungeziwe kumabhonasi ahlukahlukene wokuqamba okukhulunywe ngawo ngenhla, kufanele futhi sibone imizamo nemizamo yokuhlanganisa eyenziwe yepharadigm entsha yokuhlanganisa izinga lesistimu.

 

U-Chen Qi, umuntu osembonini ye-semiconductor, uhlaziye ukuthi kusukela endaweni yokugcina imithombo ekhona, i-Intel ine-IP ephelele ye-x86 yezakhiwo, okuwumongo wayo.Ngesikhathi esifanayo, i-Intel ine-IP yesigaba se-SerDes esisebenza ngesivinini esiphezulu njenge-PCIe ne-UCle, engasetshenziswa ukuhlanganisa kangcono nokuxhuma ngokuqondile ama-chiplets nama-Intel core CPU.Ngaphezu kwalokho, i-Intel ilawula ukwakhiwa kwamazinga e-PCIe Technology Alliance, futhi amazinga e-CXL Alliance kanye ne-UCle athuthukiswe ngesisekelo se-PCIe nawo aholwa yi-Intel, okulingana ne-Intel mastering kokubili i-IP eyinhloko kanye nokhiye ophezulu kakhulu. -Speed ​​SerDes ubuchwepheshe kanye namazinga.

 

“Ubuchwepheshe bokupakisha obuyingxube be-Intel namandla enqubo ethuthukisiwe abuthaka.Uma ingahlanganiswa nomgogodla wayo we-x86IP kanye ne-UCIe, izoba nezinsiza ezengeziwe kanye nezwi esikhathini se-OEM yesistimu, futhi idale i-Intel entsha, ezohlala iqinile. "U-Chen Qi utshele i-Jiwei.com.

 

Kufanele wazi ukuthi lawa wonke amakhono we-Intel, angeke akhonjiswe kalula ngaphambili.

 

“Ngenxa yesikhundla sayo esiqinile emkhakheni we-CPU esikhathini esedlule, i-Intel yayilawula ngokuqinile insiza eyisihluthulelo ohlelweni - izinsiza zenkumbulo.Uma amanye ama-chips ohlelweni efuna ukusebenzisa izinsiza zememori, kufanele azithole nge-CPU.Ngakho-ke, i-Intel ingakhawulela ama-chips ezinye izinkampani ngalokhu kuhamba.Esikhathini esedlule, imboni ibikhalaza ngalokhu' 'ukuzimela yedwa.'U-Chen Qi wachaza, “Kodwa ngokuthuthuka kwezikhathi, u-Intel wezwa ingcindezi yokuncintisana evela kuzo zonke izinhlangothi, ngakho kwathatha isinyathelo sokuqala ukushintsha, ukuvula ubuchwepheshe be-PCIe, futhi yasungula i-CXL Alliance kanye ne-UCle Alliance ngokulandelana, okulingana nokusebenza ngenkuthalo. ebeka ikhekhe phezu kwetafula.”

 

Ngokombono wemboni, ubuchwepheshe be-Intel nesakhiwo ekwakhiweni kwe-IC kanye nokupakishwa okuthuthukisiwe kusaqinile kakhulu.I-Isaya Research ikholelwa ukuthi ukuya kwe-Intel kumodi ye-OEM yesistimu iwukuhlanganisa izinzuzo nezinsiza zalezi zici ezimbili futhi ahlukanise ezinye iziqalo eziyisicwecwana ngomqondo wenqubo yokuma okukodwa ukusuka ekuklanyweni kuye ekupakishweni, ukuze kutholwe ama-oda engeziwe imakethe ye-OEM ezayo.

 

"Ngale ndlela, isixazululo se-Turnkey sikhanga kakhulu ezinkampanini ezincane ezinokuthuthukiswa okuyisisekelo nezinsizakusebenza ze-R&D ezinganele."I-Isaiah Research iphinde ibe nethemba mayelana nokukhangwa kokuthuthela kwe-Intel kumakhasimende amancane naphakathi nendawo.

 

Kumakhasimende amakhulu, abanye ochwepheshe bezimboni basho ngokungananazi ukuthi inzuzo engokoqobo ye-Intel yezinga le-OEM yohlelo ukuthi inganweba ukubambisana okuphumelelayo namanye amakhasimende esikhungo sedatha, njenge-Google, i-Amazon, njll.

 

“Okokuqala, i-Intel ingabagunyaza ukuthi basebenzise i-CPU IP yezakhiwo ze-Intel X86 kuma-chips abo e-HPC, esiza ekugcineni isabelo semakethe se-Intel emkhakheni we-CPU.Okwesibili, i-Intel ingahlinzeka nge-IP yephrothokholi yesixhumi esibonakalayo esinesivinini esikhulu njenge-UCle, elungele amakhasimende ukuhlanganisa enye i-IP esebenzayo.Okwesithathu, i-Intel inikeza inkundla ephelele yokuxazulula izinkinga zokusakaza nokupakisha, yakha inguqulo ye-Amazon ye-chiplet solution chip leyo i-Intel ekugcineni ezobamba iqhaza kuyo kufanele kube uhlelo lwebhizinisi oluphelele kakhulu.” Ochwepheshe abangenhla baqhubeka bengezelela.

 

Kusadingeka wenze izifundo

 

Kodwa-ke, i-OEM idinga ukuhlinzeka ngephakheji lamathuluzi okuthuthukisa inkundla futhi isungule umqondo wesevisi wokuthi "ikhasimende kuqala".Kusukela emlandweni odlule we-Intel, iphinde yazama i-OEM, kodwa imiphumela ayigculisi.Nakuba izinga lesistimu le-OEM lingabasiza babone izifiso ze-IDM2.0, izinselele ezifihliwe zisadinga ukunqotshwa.

 

“Njengoba iRoma ingakhiwanga ngosuku, i-OEM nokupakishwa akusho ukuthi konke kuhamba kahle uma ubuchwepheshe buqinile.Ku-Intel, inselelo enkulu kuseyisiko le-OEM. ”U-Chen Qi utshele i-Jiwei.com.

 

U-Chen Qijin uphinde waveza ukuthi uma i-Intel yezemvelo, njengokukhiqiza nesofthiwe, ingaxazululwa ngokusebenzisa imali, ukudluliswa kobuchwepheshe noma imodi yesikhulumi esivulekile, inselelo enkulu ye-Intel ukwakha isiko le-OEM ohlelweni, ukufunda ukuxhumana namakhasimende. , hlinzeka amakhasimende ngamasevisi awadingayo, futhi ahlangabezane nezidingo zawo ze-OEM ezihlukene.

 

Ngokocwaningo luka-Isaya, okuwukuphela kwento i-Intel okudingeka ingezelele yikhono le-wafer foundry.Uma kuqhathaniswa ne-TSMC, enamakhasimende nemikhiqizo emikhulu eqhubekayo futhi ezinzile ukusiza ukuthuthukisa isivuno senqubo ngayinye, i-Intel ngokuvamile ikhiqiza imikhiqizo yayo.Esimeni sezigaba zomkhiqizo olinganiselwe namandla, ikhono lokuthuthukisa le-Intel lokukhiqiza ama-chip lilinganiselwe.Ngemodi ye-OEM yesistimu, i-Intel inethuba lokuheha amakhasimende athile ngokuklama, ukupakisha okuthuthukile, okusanhlamvu okuyisisekelo nobunye ubuchwepheshe, nokuthuthukisa amandla okukhiqiza ama-wafer isinyathelo ngesinyathelo ukusuka enanini elincane lemikhiqizo ehlukahlukene.

 
Ngaphezu kwalokho, njengoba “iphasiwedi yethrafikhi” yezinga lesistimu ye-OEM, Ukupakisha Okuthuthukile kanye ne-Chiplet nakho kubhekana nobunzima bazo.

 

Ukuthatha ukupakishwa kwezinga lesistimu njengesibonelo, kusukela encazelweni yayo, kulingana nokuhlanganiswa kwe-Dies ehlukene ngemva kokukhiqizwa kwe-wafer, kodwa akulula.Sithatha i-TSMC njengesibonelo, kusukela kusixazululo sakudala se-Apple kuya ku-OEM yakamuva ye-AMD, i-TSMC isichithe iminyaka eminingi kubuchwepheshe bokupakisha obuthuthukile futhi yethula amapulatifomu ambalwa, njenge-CoWoS, SoIC, njll., kodwa ekugcineni, iningi lawo. sisahlinzeka ngamasevisi okupakisha athile esikhungo, okungesona isixazululo sokupakisha okunamahemuhemu okuthi sinikeza amakhasimende "ama-chips afana namabhulokhi wokwakha".

 

Ekugcineni, i-TSMC yethule inkundla ye-3D Fabric OEM ngemuva kokuhlanganisa ubuchwepheshe bokupakisha obuhlukahlukene.Ngesikhathi esifanayo, i-TSMC yabamba ithuba lokubamba iqhaza ekubunjweni kwe-UCle Alliance, futhi yazama ukuxhuma izindinganiso zayo nezindinganiso ze-UCIe, okulindeleke ukuthi zikhuthaze "amabhulokhi wokwakha" esikhathini esizayo.

 

Ukhiye wenhlanganisela yezinhlayiyana eziwumongo uwukuhlanganisa “ulimi”, okungukuthi, ukulinganisa isixhumi esibonakalayo se-chiplet.Ngalesi sizathu, i-Intel iphinde yasebenzisa isibhengezo sethonya ukuze kusungulwe indinganiso ye-UCIE ye-chip kuya ku-chip interconnection ngokusekelwe ezingeni le-PCIe.

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Ngokusobala, isadinga isikhathi “sokuvunyelwa kwamasiko” okujwayelekile.U-Linley Gwennap, umongameli kanye nomhlaziyi omkhulu we-Linley Group, ubeke phambili engxoxweni nabakwaMicronet ukuthi okudingwa yimboni ngempela kuyindlela evamile yokuxhuma ama-cores ndawonye, ​​​​kodwa izinkampani zidinga isikhathi sokuklama ama-cores amasha ukuze zihlangabezane nezindinganiso ezisafufusa.Nakuba kukhona inqubekelaphambili eyenziwe, kusathatha iminyaka engu-2-3.

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Umuntu ophezulu we-semiconductor uzwakalise ukungabaza ngombono we-multi-dimensional.Kuzothatha isikhathi ukubona ukuthi i-Intel izophinde yamukelwe yini imakethe ngemuva kokuhoxa kwayo kwinkonzo ye-OEM ngo-2019 kanye nokubuya kwayo esikhathini esingaphansi kweminyaka emithathu.Mayelana nobuchwepheshe, isizukulwane esilandelayo se-CPU okulindeleke ukuthi yethulwe yi-Intel ngo-2023 kusenzima ukukhombisa izinzuzo ngokwenqubo, umthamo wokugcina, imisebenzi ye-I/O, njll. Ngaphezu kwalokho, ipulani yenqubo ye-Intel ibambezeleke izikhathi ezimbalwa esikhathini esidlule, kodwa manje sekufanele kwenziwe ukuhlelwa kabusha kwenhlangano, ukuthuthukiswa kobuchwepheshe, ukuncintisana kwemakethe, ukwakhiwa kwefekthri kanye neminye imisebenzi enzima ngesikhathi esifanayo, okubonakala kunezela izingozi ezingaziwa kunezinselele zobuchwepheshe ezidlule.Ikakhulukazi, ukuthi i-Intel ingasungula yini i-OEM yesistimu entsha yesistimu ngesikhathi esifushane nakho kuyisivivinyo esikhulu.


Isikhathi sokuthumela: Oct-25-2022

Shiya Umlayezo Wakho