ipharamitha:
igama lepharamitha | inani lesibaluli |
Ingabe i-Rohs iqinisekisiwe? | ihlangana ne |
Amagama Ohwebo | I-XILINX (Xilinx) |
Finyelela Ikhodi Yokuthobela | compli |
Ikhodi ye-ECCN | 3A991.D |
imvamisa yewashi ephezulu | 667 MHz |
Ikhodi ye-JESD-30 | I-S-PBGA-B484 |
Ikhodi ye-JESD-609 | e1 |
Ileveli Yokuzwela Ukuswakama | 3 |
inani lokufakiwe | 338 |
Inani lamayunithi anengqondo | 147443 |
Izikhathi zokukhiphayo | 338 |
Inombolo yamatheminali | 484 |
Impahla yephakheji yomzimba | I-PLASTIC/EPOXY |
ikhodi yephakheji | I-FBGA |
Faka ikhodi efanayo | I-BGA484,22X22,32 |
Umumo wephakheji | ISIkwele |
Ifomu lephakheji | IGRIDI ARRAY, IPHISHI ELIHLE |
I-Peak Reflow Temperature (Celsius) | 260 |
ukunikezwa kwamandla kagesi | 1.2,1.2/3.3,2.5/3.3 V |
Uhlobo Lomqondo Ohlelekayo | INSIMU UHLELO LWESANGO ARRAY |
Isimo sesitifiketi | Awufaneleki |
intaba ephezulu | YEBO |
ubuchwepheshe | I-CMOS |
Indawo yetheminali | I-TIN SILVER COPER |
Ifomu letheminali | IBHOLA |
I-Terminal pitch | 0.8 mm |
Indawo yetheminali | PHANSI |
Isikhathi esiphezulu kuzinga lokushisa eliphakeme lokugeleza kabusha | 30 |
Incazelo Ejwayelekile :
I-Xilinx® 7 series FPGAs ihlanganisa imindeni emine ye-FPGA ebhekelela uhla oluphelele lwezidingo zohlelo, kusukela ezindlekweni eziphansi, ifomu elincane,
izinhlelo zokusebenza ezizwelayo izindleko, zevolumu ephezulu kumkhawulokudonsa wokuxhuma osezingeni eliphezulu, umthamo onengqondo, nekhono lokucubungula isignali kokudinga kakhulu
izinhlelo zokusebenza ezisebenza kahle kakhulu.Ama-FPGA angu-7 ahlanganisa:
• I-Spartan®-7 Family: Ilungiselelwe izindleko eziphansi, amandla aphansi, naphezulu
Ukusebenza kwe-I/O.Itholakala ngenani eliphansi, into encane kakhulu
ukupakishwa kwe-PCB footprint encane kakhulu.
• I-Artix®-7 Family: Ilungiselelwe izinhlelo zokusebenza zamandla aphansi ezidinga i-serial
ama-transceivers kanye ne-DSP ephezulu kanye ne-logic throughput.Inikeza okuphansi kakhulu
isamba sezindleko zezinto zokwakha zokukhiqiza okuphezulu, okuzwela izindleko
izicelo.
• I-Kintex®-7 Family: Ilungiselelwe ukusebenza kahle kwentengo nge-2X
ukuthuthukiswa uma kuqhathaniswa nesizukulwane sangaphambilini, okuvumela isigaba esisha
we-FPGAs.
• I-Virtex®-7 Family: Ilungiselelwe ukusebenza kwesistimu okuphezulu kanye
umthamo ngokuthuthukiswa kwe-2X ekusebenzeni kwesistimu.Okuphakeme kakhulu
amadivayisi amandla anikwe amandla yi-silicon estacked interconnect (SSI)
ubuchwepheshe.
Yakhelwe phezu kobuchwepheshe besimanjemanje, ukusebenza okuphezulu, amandla aphansi (HPL), 28 nm, isango lensimbi eliphezulu (HKMG) lobuchwepheshe benqubo, ama-FPGA angu-7 anika amandla i-
ukwanda okungenakuqhathaniswa kokusebenza kwesistimu nge-2.9 Tb/s yomkhawulokudonsa we-I/O, umthamo weseli enengqondo eyizigidi ezingu-2, kanye no-5.3 TMAC/s DSP, kuyilapho kudla ngaphansi ngo-50%
amandla kunamadivayisi esizukulwane sangaphambili ukuze anikeze enye indlela ehlelekayo ngokugcwele kuma-ASSP nama-ASIC.
Isifinyezo sezici eziyisi-7 ze-FPGA
• Ilogic ye-FPGA esezingeni eliphezulu esekelwe ekubukekeni kwangempela kokokufaka okungu-6
ithebula eliphezulu (LUT) ubuchwepheshe obulungisekayo njengememori esabalalisiwe.
• I-RAM yebhulokhi ye-dual-port engu-36 Kb enengqondo ye-FIFO eyakhelwe ngaphakathi yedatha eku-chip
ukugcina kumthamo.
• Ubuchwepheshe bokusebenza okuphezulu kwe-SelectIO™ obunosekelo lwe-DDR3
ukuxhumana okufika ku-1,866 Mb/s.
• Uxhumano lwe-serial olunesivinini esikhulu ngama-transceivers akhelwe ngaphakathi ama-multi-gigabit
kusuka ku-600 Mb/s kuya ku-max.amanani angu-6.6 Gb/s afika ku-28.05 Gb/s, anikeza a
imodi ekhethekile yamandla aphansi, elungiselelwe ukuxhumana kwe-chip-to-chip.
• I-analog interface yomsebenzisi elungisekayo (XADC), ehlanganisa okukabili
12-bit 1MSPS iziguquli ze-analog-to-digital ezine-on-chip thermal kanye
hlinzeka ngezinzwa.
• Izingcezu ze-DSP ezino-25 x 18 wokuphindaphinda, i-accumulator engu-48-bit, kanye ne-pre-adder
ngokuhlunga okusebenza kahle kakhulu, okuhlanganisa nokulinganisa okulungiselelwe
ukuhlunga i-coefficient.
• Amathayili okuphatha iwashi anamandla (CMT), ahlanganisa ukukhiywa kwesigaba
iluphu (PLL) kanye nomphathi wewashi lemodi exubile (MMCM) amabhlogo aphezulu
ukunemba kanye ne-jitter ephansi.
• Khipha ngokushesha ukucubungula okushumekiwe nge-MicroBlaze™ processor.
• Ibhulokhi ehlanganisiwe ye-PCI Express® (PCIe), kuze kufike ku-x8 Gen3
Imiklamo ye-Endpoint kanye ne-Root Port.
• Okunhlobonhlobo okunhlobonhlobo kokucushwa, okuhlanganisa ukwesekwa kwe
izinkumbulo zempahla, ukubethela kwe-256-bit AES nge-HMAC/SHA-256
ukuqinisekiswa, nokutholwa kwe-SEU eyakhelwe ngaphakathi nokulungiswa.
• Izindleko eziphansi, i-wire-bond, i-bare-die flip-chip, kanye ne-flip yesiginali ephezulu
i-chip packaging enikeza ukufuduka okulula phakathi kwamalungu omndeni ku
iphakheji efanayo.Wonke amaphakheji atholakala nge-Pb-free futhi akhethiwe
amaphakheji kunketho ye-Pb.
• Idizayinelwe ukusebenza okuphezulu namandla aphansi nge-28 nm,
I-HKMG, inqubo ye-HPL, i-1.0V core voltage process technology kanye
Inketho ye-voltage engu-0.9V yamandla aphansi ngisho nangaphansi.